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Chipmaker IBM has flaunted its new Wii U processor as “some of our most advanced technology packed into an energy-saving silicon package”.
Nintendo unveiled its next-gen console at its E3 2011 press conference, showing off the system’s unique control interface.
Today IBM has confirmed it will continue its longstanding relationship with Nintendo by providing millions of processors for the console.
IBM said its unique embedded DRAM “is capable of feeding the Wii U’s multi-core processor large chunks of data to make for a smooth entertainment experience”.
The arrangement is to produce millions of chips for Nintendo featuring IBM Silicon on Insulator (SOI) technology at 45 nanometers (45 billionths of a meter), IBM said.
IBM said the chip is ideal for “performance-driven applications that demand exceptional, power-efficient processing capability”.
Nintendo’s deal with IBM continues a long-running relationship between the two firms.
In 1999 IBM was selected to manufacture Gamecube microprocessor, and since 2006 the firm has shipped over 90 million Wii chips.
"IBM has been a terrific partner for many years,” said Nintendo R&D boss Genyo Takeda.
“We truly value IBM’s commitment to support Nintendo in delivering an entirely new kind of gaming and entertainment experience for consumers around the world," he added.
[Image used for illustrative purposes]
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